Low power
| Images | Model | Package size(mm) | Chip(mil) | Wavelength(nm) | Encapsulation form | Electric current(mA) | Bin | Power(mW) | Voltage(V) | Radiant angle(°) | Specification | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SCF35BUB00D1Z5 | 3.5*3.5 | 20*20 | 305-310 | 陶瓷封装 | 60 | BA006 BA008 BA010 | 6~8 8~10 10~12 | C10 5.00~5.50 C11 5.50~6.00 C12 6.00~6.50 C13 6.50~7.00 | >120 |  |
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|
SCF35BUB00D1Z6 | 3.5*3.5 | 2.0*1.0 | 305-310 | 陶瓷封装 | 20 | BA001 BA003 | 1~3 3~5 | C10 5.0~5.5 C11 5.5~6.0 C12 6.0~6.5 C13 6.5~7.0 | >120 | |
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Contact us
UV business consulting
E-mail:na-uv_inquiry@sanan-e.com
Tel:+86-595-83355932
UVC packaging and application technoligy support
