Low power
| Images | Model | Package size(mm) | Chip(mil) | Wavelength(nm) | Encapsulation form | Electric current(mA) | Bin | Power(mW) | Voltage(V) | Radiant angle(°) | Specification | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SCF35BUC00D1Z3 | 3.5*3.5 | 20*10 | 270-280 | 陶瓷封装 | 20 | BA002 BA004 BA006 | 2~4 4~6 6~8 | C09 4.5~5.0 C10 5.0~5.5 C11 5.5~6.0 C12 6.0~6.5 C13 6.5~7.0 C14 7.0~7.5 | >120 |  |
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|
SCF35BUC00D1Z1 | 3.5*3.5 | 20*20 | 270-280 | 陶瓷封装 | 40 | BA002 BA004 BA006 | 2~4 4~6 6~8 | C09 4.5~5.0 C10 5.0~5.5 C11 5.5~6.0 C12 6.0~6.5 C13 6.5~7.0 C14 7.0~7.5 | >130 | |
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SCM13AUC00F1Z1 | 1.3*1.3 | 20*20 | 270-280 | 陶瓷封装 | 40 | BA002 BA004 BA006 BA008 BA010 | 2~4 4~6 6~8 8~10 10~12 | C09 4.5~5.0 C10 5.0~5.5 C11 5.5~6.0 C12 6.0~6.5 C13 6.5~7.0 C14 7.0~7.5 | >120 | |
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Medium power
| Images | Model | Package size(mm) | Chip(mil) | Wavelength(nm) | Encapsulation form | Electric current(mA) | Bin | Power(mW) | Voltage(V) | Radiant angle(°) | Specification | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SCF35BUC00D1Z4 | 3.5*3.5 | 30*30 | 270-280 | 陶瓷封装 | 100 | CA010 CA015 | 10~15 15~20 | C09 4.5~5.0 C10 5.0~5.5 C11 5.5~6.0 C12 6.0~6.5 C13 6.5~7.0 C14 7.0~7.5 | >130 | |
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SCM35BUC00E1Z2 | 3.65*3.65 | 20*20 | 270-280 | 陶瓷封装 | 100 | CA008 CA013 CA018 CA023 | 8~13 13~18 18~23 23~28 | C09 4.5~5.0 C10 5.0~5.5 B22 5.5~5.75 B23 5.75~6.0 B24 6.0~6.25 B25 6.25~6.5 B26 6.5~6.75 B27 6.75~7.0 C14 7.0~7.5 | >130 | |
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High-power
| Images | Model | Package size(mm) | Chip(mil) | Wavelength(nm) | Encapsulation form | Electric current(mA) | Bin | Power(mW) | Voltage(V) | Radiant angle(°) | Specification | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SCD35BUC0061Z1 | 3.5*3.5 | 42*42 | 270-280 | 陶瓷封装 | 350 | CA035 CA040 CA045 CA050 CA055 CA060 CA065 CA070 CA075 CA080 CA085 CA090 CA095 | 35~40 40~45 45~50 50~55 55~60 60~65 65~70 70~75 75~80 80~85 85~90 90~95 95~100 | C09 4.5~5.0 C10 5.0~5.5 C11 5.5~6.0 C12 6.0~6.5 C13 6.5~7.0 C14 7.0~7.5 | <80 | |
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SCM35BUC00E1Z1 | 3.45*3.45 | 42*42 | 270-280 | 陶瓷封装 | 350 | CA035 CA040 CA045 CA050 CA055 CA060 | 35~40 40~45 45~50 50~55 55~60 60~65 | C09 4.5~5.0 C10 5.0~5.5 C11 5.5~6.0 C12 6.0~6.5 C13 6.5~7.0 C14 7.0~7.5 | >140 | |
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Ultra high power
| Images | Model | Package size(mm) | Chip(mil) | Wavelength(nm) | Encapsulation form | Electric current(mA) | Bin | Power(mW) | Voltage(V) | Radiant angle(°) | Specification | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SCF68AUC00D4Z1 | 6.8*6.8 | 4*42*42 | 270-285 | 陶瓷封装 | 350 | EA150 EA170 EA190 | 150~170 170~190 190~210 | F04 20~25 F05 25~30 | >130 | |
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Contact us
UV business consulting
E-mail:na-uv_inquiry@sanan-e.com
Tel:+86-595-83355932
UVC packaging and application technoligy support
